8th/9th Generation Intel® Core™ i3 Processor, Intel® Xeon® E-2100/2200 Series Processor
Supports Hyper-Threading technology, up to 16 threads with 8 cores;
Support virtualized device input/output
(VT-d)—-Adds device input/output virtualization to the previous CPU virtualization, which can effectively improve the performance and efficiency of virtual machines;
Turbo Mode
Dynamic acceleration of kernel operation. The kernel operation can be turned on, off and accelerated as needed;
Support Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 instruction sets;
Cache design: A three-level fully-inclusive cache design is adopted. The design of L1 is the same as the Core microarchitecture. L2 adopts an ultra-low latency design with 256KB per core. L3 adopts a shared design and is shared by all cores on the chip.
Integrated Memory Controller (IMC) – Moved from the chipset to the CPU chip, supports multi-channel DDR4 memory, significantly reduces memory read latency and increases memory bandwidth by up to three times compared to the previous generation.
Fast Channel—DMI Bus:
DMI is a point-to-point connection technology that replaces the front-end bus (FSB); DMI uses a serial connection as the signal transmission method and adopts LVDS (low voltage differential signal technology, mainly used for high-speed digital signal interconnection, so that the signal can be transmitted at a rate of more than several hundred Mbps) signal technology; the reliability, practicality and applicability characteristics provide a guarantee for the high availability of DMI; the bandwidth of each 20-bit wide DMI connection can reach an astonishing 25.6GB per second, which is far beyond the comparison of FSB.
Virtualization Technology VT
Support for virtualized device input/output (VT-d) – Adding virtualization of device input/output on the basis of the previous virtualization of CPU can effectively improve the performance and efficiency of virtual machines, and provide a strong guarantee for server integration, migration of original data and security.
Configure on demand
Provide the best configuration options based on the actual needs of users.
High Availability
With the processor HyperThreading technology, it supports multi-threaded and multi-tasking modes. The processor integrates a DDR4 memory controller to provide a highly optional memory solution. It provides IRST (RAID 0/1/10/5) function to meet the system’s requirements for hard disk security while taking into account user cost requirements. It integrates Intel server-level dual 1000M network adapters, supports link aggregation and binding redundancy functions, and is suitable for a variety of application requirements.
High system scalability
Supports 8th/9th generation Intel® Core™ i3 processors, Intel® Xeon® E-2100/2200 series processors, 4 DIMM memory slots can support up to 128GB of Unbuffered DDR4 ECC 2666MHz memory, and the system can support up to 4 3.5/2.5-inch hard drives (optional 4-bit hot-swappable hard drive module)
SATA/SAS hard disk expansion slot
Support hot-swap solution to achieve online maintenance function. Provide 3 PCI-E slots: 1 PCI-E3.0 x8 (in x16), 2 PCI-E 3.0 x4 (in x8); support half-height card expansion slot, providing users with sufficient expansion space.
safety
The motherboard provides a TPM trusted module interface, and users can choose according to their needs
manage
Integrated BMC module, supports IPMI2.0, provides 1 RJ45 management network port, supports remote management, iKVM
Cost-effective solution
PT6280C uses a server motherboard based on Intel® C242 chipset, supports 1 LGA1151, 8th/9th generation Intel® Core™ i3 processor, Intel® Xeon® E-2100/2200 series processor, the motherboard provides 4 memory slots, supports up to 64GB DDR4 2666MHz ECC UDIMM; the motherboard natively supports 6 SATA3 (6Gbps) hard disk interfaces. Integrated RAID controller, supports low-cost RAID 0, 1, 10, high-reliability RAID5 (only windows OS) to improve data processing performance and protect data functions. Integrated dual Gigabit Intel server network card, it is very suitable for small and medium-sized enterprises information carrying platform.
Advanced chassis design technology
The intelligent heat dissipation system is used to effectively reduce noise pollution and create a constant temperature space in the box; it is fully shielded against electromagnetic radiation, anti-interference, and anti-static (EMI) design.









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